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NZ packaging scholarship launched

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Nov 23, 2017  -  The Packaging Council of New Zealand is launching a new annual Scholarship program, in conjunction with the Australian Institute of Packaging (AIP), that will enable one packaging technologist, designer or engineer in New Zealand the opportunity to complete a Diploma in Packaging Technology to the value of $9,000.

“The association is extremely proud to be able to offer the scholarship to a New Zealand packaging professional each year,” commented Harry Burkhardt, President of the Packaging Council of New Zealand.

“The packaging industry is dynamic and diverse, offering career opportunities across a wide scope of disciplines. PAC.NZ has been representing businesses in the packaging industry in New Zealand since 1992 and recognises that investment in the packaging industry starts with investment in its people. We strongly encourage everyone in the industry to apply for this scholarship.

“The Diploma in Packaging Technology is a Level 5 qualification which is internationally recognised for those wishing to pursue a career in the packaging industry or for those who are already in the industry and who wish to extend their knowledge and expertise. The Diploma in Packaging Technology prepares students to take responsibility for packaging operations at any level through the supply chain. The qualification is comprehensive, and provides an opportunity to study the principles of packaging, packaging materials and packaging processes.”

Diploma in Packaging Technology students come from a variety of backgrounds and disciplines, and are typically experienced practitioners or managers in technical, sales/marketing, QA, purchasing, engineering or design.

Completion of the Diploma in Packaging Technology demonstrates a commitment to your career and to the industry. Delegates who successfully complete the Diploma are equipping themselves for senior positions within the packaging industry.

Entries are now open with submissions closing on the 23rd of February 2018. The winner of the inaugural Packaging Council of New Zealand Scholarship will be announced at the 2018 Packaging & Processing Innovation & Design Awards; which will be held alongside of the prestigious international WorldStar Packaging Awards on 2 May.

| A NZ Packaging Council release  ||  November 23,  2017   |||

 

 

Published in PACKAGING
Tagged under
  • Packaging
  • news talk
  • factory floor updates

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